Sensors, MEMS, and Nanotechnology

In developing a new product, one starts with proper evaluation and selection of the technology to be deployed in the product based on customer need.  Doped silicon is often the technology of choice for electromechanical applications.  DiPaola Consulting specializes in doped silicon applications with advanced modeling and analytical capabilities that include solid modeling, finite element analysis, MATLAB simulations, electrical models, ion implantation simulations, and design of experiments. Below is an example of using FEA to mitigate packaging mounting stress from influencing sensor performance. This sensor is used to monitor clutch control pressure for a closed-loop control transmission application.

MEMS and Nano sensor package design is a key consideration to ensure parasitic strains do not influence the accuracy of the sensor.  Through several partnerships, DiPaola Consulting also provides MEMS prototyping services.  We have excellent relationships with highly capable foundries to provide feedback during the design phase and technology transfer for design validation and production.  Furthermore, we have developed key relationships with academic centers and renowned experts to stay informed of the latest MEMS and Nanotechnology advancements.

Often one project leads into another. I performed reverse engineering of a MEMS microphone for one customer and consulted with another on a protective membrane to keep water out of MEMS microphones on mobile devices. The latter is now sold on tens of millions of phones. 

Our extensive experience has taught us that the core elements of the technology must be designed concurrently with the sensor packaging and system integration.  The most important aspects of this design process entails keeping out the environment, eliminating or minimizing packaging effects on device performance, design for manufacture, measurement, and commercialization (capable supplier base), and making it robust to external forces that may result in damage or malfunction. We excel at providing solutions to some of the harshest, safety critical applications in the industry.

The software that controls the sensor, performs data analytics, and provides the user interface is equally important. Specific firmware and edge computing may be performed locally or closer to the data source while other operations are performed at the system level or in the cloud. For example, control of a wireless inertial measurement unit (sample rate, power, sleep mode, range, etc.) is performed through sensor firmware along with data transmission while data analytics and AI may be performed in the cloud or on a mobile device. A simple example is shown below where sensor firmware is written in C and the mobile device creates a plot of the data. 

With our history of developing products and processes with next to zero field failures, we recognize that process development and product validation are key aspects to achieving low cost and high reliability.  In every phase from concept to final design validation, process development and device testing provide continual feedback for design improvements.  We ensure that each process is capable from the start through rigorous research, parameter variation, capability measurements, and fundamental validation.

We also believe in product testing to failure and not just to the customer specification to fully understand the inherent weaknesses of the product.  Through these rigorous and field-tested principles and methodologies, we consistently exceed customer expectations in the design and commercialization of our sensor, MEMS and Nano products.

Below is a sampling of sensors I have worked on during my career both at DiPaola Consulting and TI / Sensata Technologies.