Leadership and Management Solutions

  • Company and R&D vision development
  • Product road-maps
  • Leadership evaluation, selection and management structuring
  • Due diligence of mergers and acquisitions
  • Creation and negotiation of business contracts
  • Customer development and communications 
  • Market analysis and strategy development
  • Development of global engineering teams and productivity improvements
  • Development and management of R&D budgets and product business plans
  • Intellectual property creation, patent analysis, competitive landscape
  • Development and implementation of new product initiative programs, standards and core building blocks to reduce time to market and achieve ultra high reliability
  • Lean manufacturing practices
  • Cross collaboration and concurrent design between business functions
  • Continuous quality improvement, metric evaluation / selection and plan implementation
  • ISO\TS and FDA certification preparation
  • Supplier selection and management
  • Cleanroom, facilities and equipment planning and management

Design and Process Engineering Solutions

  • Innovative product design from initial concept to production Launch
  • Sensor, electromechanical, metal, fiberglass, ceramic and plastic molded products
  • MEMS design, prototype and system integration
  • Foundry selection and transfer
  • Product cost improvement solutions
  • Hermetic design and environmental sealing
  • High temperature electronics packaging
  • Material selection
  • Technology evaluation and selection
  • Design verification through various analytical techniques, FMEA, tolerance stacks, 3D modeling and finite element analysis
  • Failure analysis and reverse engineering reports including FESEM
  • Nondestructive 3D computed tomography X-ray
  • Data analysis and interpretation
  • Measurement system analysis and metrology
  • Design and process validation including design of experiments
  • Process development and optimization including flip chip and other semiconductor package assembly, wirebonding, soldering, conductive epoxy, conductive silicones, polymer dispensing, molding, plating, welding, lamination and micromachining  
  • YIeld and cycle time improvements

Microfabrication and Packaging Capabilites

  • Through partnership with Silex, NIST and The Richard Desich SMART Commercialization Center for Microsystems

Sensata Pressure Sensor
See Patent No. 6,763,724 for All Inventors
Photo by DiPaola Consulting
Displayed with Agreement from Sensata


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