• New product design from initial concept to production 
• Sensor, electromechanical, metal, fiberglass, ceramic and plastic molded products
• MEMS design, prototype and system integration 
• Hermetic design and environmental sealing
• High temperature electronics packaging
• Material selection
• Technology evaluation and selection
• Design verification through various analytical techniques, FMEA, tolerance stacks, 3D modeling and finite element analysis
• Failure analysis and reverse engineering reports including FESEM
  
• Data analysis and interpretation
• Measurement system analysis and metrology
• Design and process validation including design of experiments
• Process development and optimization including flip chip and other semiconductor package assembly, wirebonding, soldering, conductive epoxy, conductive silicones, polymer dispensing, molding, plating, welding, lamination and micromachining  
• Supplier selection and management
• Quality metric evaluation and implementation
• Continuous improvement
• ISO\TS and FDA certification preparation
• Competitive analysis  
• Customer communications
• Employee development and leadership coaching
• Developing product growth strategies
• Intellectual property creation
• Patent development and drawings 
• Developing product business plans for third party funding

• Wafer procurement including SOI
• Nanostrip and RCA clean
• Wafer bonding
• Thermal silicon dioxide (wet or dry)
• Low pressure chemical vapor deposition (silicon nitride, polysilicon and low temperature oxidation)
• Plasma enhanced chemical vapor deposition (silicon dioxide, silicon nitride and polysilicon)
• Mask design and external fabrication
• Contact lithography (front to back alignment), stepper lithography (< 0.5 micron resolution) and electron beam lithography
• Ion implantation and diffusion (subcontract)
• KOH wet etch
• Plasma etch, reactive ion etch (RIE) and deep silicon etch (DRIE) per the Bosch process
• Electron beam evaporation and sputtered thin film deposition
• Back end processes including critical point drying, wafer dicing, wirebonding (gold and aluminum), die attach, solder and epoxy interconnects, underfill, encapsulation and external packaging
• Parylene deposition
• Laser drilling
• Optical microscopes (including x, y and z measurements), ellipsometry and profilometry (up to 1 mm)

PARTNERSHIPS