Leadership and Management Solutions

  • Company and R&D vision development
  • Product road-maps
  • Leadership evaluation, selection and management structuring
  • Due diligence of mergers and acquisitions
  • Creation and negotiation of business contracts
  • Customer development and communications
  • Market analysis and strategy development
  • Development of global engineering teams and productivity improvements
  • Development and management of R&D budgets and product business plans
  • Intellectual property creation, patent analysis, competitive landscape
  • Development and implementation of new product initiative programs, standards and core building blocks to reduce time to market and achieve ultra high reliability
  • Lean manufacturing practices
  • Cross collaboration and concurrent design between business functions
  • Continuous quality improvement, metric evaluation / selection and plan implementation
  • ISO\TS and FDA certification preparation
  • Supplier selection and management
  • Cleanroom, facilities and equipment planning and management

Design and Process Engineering Solutions

  • Innovative product design from initial concept to production Launch
  • Sensor, electromechanical, metal, fiberglass, ceramic and plastic molded products
  • MEMS design, prototype and system integration
  • Foundry selection and transfer
  • Product cost improvement solutions
  • Hermetic design and environmental sealing
  • High temperature electronics packaging
  • Material selection
  • Technology evaluation and selection
  • Design verification through various analytical techniques, FMEA, tolerance stacks, 3D modeling and finite element analysis
  • Failure analysis and reverse engineering reports including FESEM
  • Nondestructive 3D computed tomography X-ray
  • Data analysis and interpretation
  • Measurement system analysis and metrology
  • Design and process validation including design of experiments
  • Process development and optimization including flip chip and other semiconductor package assembly, wirebonding, soldering, conductive epoxy, conductive silicones, polymer dispensing, molding, plating, welding, lamination and micromachining
  • YIeld and cycle time improvements

Microfabrication and Packaging Capabilites

  • Through partnership with several foundries, NIST and The Richard Desich SMART Commercialization Center for Microsystems

Markets Served

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