Automotive

  • VP of Global R&D for sensing and controls division with eight direct reports, Global Engineering Directors, and a total staff of 330 scientists, engineers and technicians in 6 countries (Americas, Europe and Asia). Developed and managed >$25 Million R&D budget.  S&C division was ~$500 M in net revenue. (TT Electronics)
  • Engineering manager and technical staff (15 years) developing MEMS and sensor products (force, pressure and position).  (Texas Instruments and Sensata Technologies)
  • Completed due diligence and business / integration evaluation of multiple mergers and acquisitions. (DiPaola Consulting)
  • Developed business plan for a multi-million dollar MEMS based business for a technology company.  (DiPaola Consulting)
  • Provided market, competitive and technical analysis to financial investors.  (DiPaola Consulting)
  • Completed package design and analysis for an automotive O2 sensor. (DiPaola Consulting)
  • Leader / individual contributor for the development of MEMS based pressure sensor array to monitor clutch control pressure with potential revenue of $70 M / year. Optimized sensor design with FEA to mitigate mounting and thermal sensitivity to achieve high accuracy yet minimize cost and size. Designed MEMS sense element and achieved a 3X cost reduction using a pure play foundry versus an off-the-self approach. (Sensata Technologies)
  • Led packaging development for MEMS based sensors for high growth businesses in diesel exhaust and vacuum brake boost pressure sensing totaling $20 M NR/year. Developed processes and co-built sample line to support customer demand and design validation. (Sensata Technologies)
  • Led internal mode switch team on the identification of high contact resistance failures occurring in the field and implemented a proprietary bright nickel plating solution improving device life 12X. Developed a leaf spring stabilization process to reduce contact force loss over time, making the design more robust to severe vibration. (Sensata Technologies)
  • Led engineering effort on DCX Occupant Weight Sensor integration, greatly influencing customers’ technical direction. Invented and patented the stress reduction component leading to a 5-fold improvement in sensor accuracy. Developed an innovative broaching process in hardened stainless steel to create geometry that eliminated sensor body rotation during assembly with common tooling. $60 M in NR/yr.  (Sensata Technologies)
  • Managed teams of engineers and technicians in the development of MEMS based pressure sensors and transmission position switches in sustaining and new product launch activities with $110 M in NR/yr.  (Sensata Technologies)
  • Managed clean room operations for corporate development center.  (Sensata Technologies)
  • Co-championed and provided technical leadership in the creation of an internal metrology lab to drastically improve capability and quality of dimensional measurement results within the organization.  (Sensata Technologies)
  • Designed and launched microfused strain gauge pressure sensors with heavy emphasis on leading the development and integration of core technology building blocks used across product lines.  (Texas Instruments and Sensata Technologies)
  • Designed circuit module assemblies with heavy emphasis on resolution of process related failure modes.  (Sensata Technologies)

Heavy Truck and Off Road

  • VP of Global R&D for sensing and controls division with eight direct reports, Global Engineering Directors, and a total staff of 330 scientists, engineers and technicians in 6 countries (Americas, Europe and Asia). Developed and managed >$25 Million R&D budget.  S&C division was ~$500 M in net revenue. (TT Electronics)
  • Engineering manager and technical staff (15 years) developing MEMS and sensor products (force, pressure and position).  (Texas Instruments and Sensata Technologies)
  • Completed due diligence and business / integration evaluation of multiple mergers and acquisitions. (DiPaola Consulting)
  • Identified moisture entry as the root cause of prominent sensor field failures and completely eliminated field issue with the identification, qualification and implementation of an alternative silicone sealant. (Sensata Technologies)
  • Designed and launched microfused strain gauge pressure sensors with heavy emphasis on leading the development and integration of core technology building blocks used across product lines.  (Texas Instruments and Sensata Technologies)
  • Designed and launched various pressure sensors with ceramic capacitive sensing technology.  Solved numerous process related issues across multiple products.  (Texas Instruments)

Biomedical

  • VP of Global R&D for sensing and controls division with eight direct reports, Global Engineering Directors, and a total staff of 330 scientists, engineers and technicians in 6 countries (Americas, Europe and Asia). Developed and managed >$25 Million R&D budget.  S&C division was ~$500 M in net revenue. (TT Electronics)
  • Developed detailed design and finite element analysis model for MEMS capacitive pressure sensor for a medical guide wire application. (DiPaola Consulting)
  • Completed a comprehensive marketing study for a customer who performs research and development of medical devices. (DiPaola Consulting)
  • Developed detailed business and FDA approval plans for a device and method to assist in Cesarean section delivery for an Attending OB/GYN. (DiPaola Consulting)
  • Provided technical guidance on the packaging design for a MEMS neural probe for a biomedical company. Co-developed a robust method for flip chip on flex and Pb-free solder attachment to significantly improve yield. (DiPaola Consulting)
  • Developed a detailed design for an implantable MEMS sensor for a biomedical application to monitor tendon repair after surgery.  (DiPaola Consulting)
  • Increased process yield for illicit drug screening and provided management consulting for a medical lab.  (DiPaola Consulting)

Industrial

  • VP of Global R&D for sensing and controls division with eight direct reports, Global Engineering Directors, and a total staff of 330 scientists, engineers and technicians in 6 countries (Americas, Europe and Asia). Developed and managed >$25 Million R&D budget.  S&C division was ~$500 M in net revenue. (TT Electronics)
  • Engineering manager and technical staff (15 years) developing MEMS and sensor products (force, pressure and position).  (Texas Instruments and Sensata Technologies)
  • Completed due diligence and business / integration evaluation of multiple mergers and acquisitions. (DiPaola Consulting)
  • Provide market, competitive and technical analysis to financial investors.  (DiPaola Consulting)
  • Completed layout, equipment selection and process flow for electro-mechanical packaging clean room (class 1000) facility. (DiPaola Consulting)
  • Designed sensor packages for MEMS based wireless sensor, a pressure sensor and a chemical sensor for industrial applications. (DiPaola Consulting)
  • Provided process development support to improve yield for mesoscale electronics with significant trace width reduction in comparison to PCB’s. (DiPaola Consulting)
  • Designed a RFID asset tracking system to automate documentation of equipment inventory and location.  (DiPaola Consulting)

Defense

  • Designed sensor packaging for a pressure sensor in a defense application. (Texas Instruments)
  • Performed a feasibility study to significantly reduce cost and improve the design of a silicon temperature sensor for cryogenic applications. (DiPaola Consulting)

Consumer Electronics

  • Conducted feasibility study of wireless motion monitoring technology for sports application. (DiPaola Consulting)
  • Provided technical consulting to a multi-billion dollar company on moisture / fluid resistance strategies, process techniques, design and market analysis for a device used in consumer electronics. (DiPaola Consulting)
  • Provided technical consulting to a large corporation on market, competitive analysis, design and process for MEMS microphones, pressure and optical sensors. (DiPaola Consulting)
  • Authored a reverse engineering report of STMicroelectronics omnidirectional digital microphone for the largest MEMS publication. (DiPaola Consulting)

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